Gold Wire Bonding Machine

The winding reel has a plate type clutch with ring gear and adjustable ring nut on the transmission that permits gradual start up of the machine to prevent the wire from breaking.

Gold wire bonding machine.

Then he needs to load the dummy. The technician needs to prepare and sets the capillary and the gold wire into machine. It uses force power time temperature up to 150 c and ultrasonic energy. Kulicke soffa k s are the world leaders for automatic wire bonders.

The machine frame has a cast iron support a metal base and a heavy duty cast iron drawing roller. If copper wire is used nitrogen must be used as a cover gas to prevent the copper. Ball bonding is a type of wire bonding and is the most common way to make the electrical interconnections between a chip and the outside world as part of semiconductor device fabrication. We manufacture wire bonders die bonders die attach epoxy die attach pull tester and shear tester for the semiconductor industry.

Gold or copper wire can be used though gold is more common because its oxide is not as problematic in making a weld. This gold silver wire draw machine comes with interchangeable steel reel winders for winding the drawn wire. The kns gold wire bonders copper stud bump wire aluminium ultrasonic wedge bonding systems are very easy to operate and are ideal for universities development laboratories through to medium volume production facilities. This method is commonly known as thermosonic gold ball wire bonding.

The bondjet bj855 meets the increasing demands of wire bonding and contributes to easy porting through smart functions such as the bondhead memory or the chip libraries. Next the technician needs to set the parameter of wire bonding machine and used the dummy of the lead frame which have the die for setting. The most common approach in thermosonic bonding is to ball bond to the chip then stitch bond to the substrate. Heraeus offers a wide selection of gold ball bonding wires in a full range of diameters to suit your applications from high power and discrete components to high pin count ultra fine pitch devices.

Typical applications for wire wire bonders are components in hf and rf technology cob mcm hybrids optical and automotive electronics. Wire bonding wedge bonding ball bonding bump bonding. Technician needs to program the pattern into the wire bonding machine system. Levels of automation vary from completely manual to fully automatic.